Corner and Edge Bonding, Die Attachment, and Underfilling

All of our corner bonding, edge bonding, die attachment and underfilling adhesives can be dispensed manually or using automated dispensing systems. They meet global regulatory standards, including RohS, REACH, UL, and IPC. The adhesives offer high resistance to thermal cycling and are made with low ionic content-less than 10 ppm. Complete assembly solutions can be developed quickly from this diverse grouping.

Printed Circuit Board (PCB) and Flexible Printed Circuit (FPC) assembly processes are continuously changing to accommodate component modifications that increase speed and decrease package size. These changes have a direct impact on the adhesives used in component attachment. Adhesive manufacturers must constantly be in synch with new technology, and provide products that optimize manufacturing processes and the operating performance of the circuit.

Tangent offers a broad selection of adhesive products to address these challenges. They include light curable acrylics and cationic epoxies, as well as room temperature and thermal curing epoxies. Complete assembly solutions can be developed quickly from this diverse grouping.

Corner and edge bonding of BGA and similar surface mounted components is efficiently accomplished using Tangent’s selection of light curable adhesives. This grouping includes our exclusive LEDcure adhesive technology. LEDcure products from Tangent fully cure in seconds under low intensity UV/visible or Visible light. They are ideal for pairing with LED curing equipment. These high strength, flexible adhesives can minimize vibration and thermal interconnect stresses between the circuit board and BGA.

Die attachment and flip-chip underfilling adhesives are also available from Tangent. Light/thermal curable acrylates, cationic epoxies, and conductives deliver the properties demanded from these applications. These products are produced by Panacol-Elosol GmbH, and are identified under the Vitralit®, Elecolit®, and Structalit® brands. Panacol-Elosol GmbH is a member of the Honle Group headquartered in Germany, and has been formulating and manufacturing adhesives for over 30 years. Tangent is the exclusive distributor for these adhesives in the Americas.

All of our die attachment and underfilling adhesives can be dispensed manually or using automated dispensing systems. They are formulated to meet global regulatory standards, including RohS, REACH, UL, and IPC. The adhesives offer high resistance to thermal cycling and are made with low ionic content-less than 10 ppm. The consistent performance of this adhesive selection will reduce flip-chip thermal cycling stresses, ultimately increasing the fatigue life of the entire circuit assembly.

View the adhesive selections listed below for possible candidates for your corner bonding, edge bonding, die attachment, and underfilling applications. Please contact Tangent to confirm your product selection and to secure additional application assistance, including samples and process recommendations. In the event that these standard products do not satisfactorily address your performance requirements, Tangent will investigate other solutions that include development of adhesive specifically tailored to the complexity of your application.

Product NumberSuitable ApplicationsViscosity cP mPaShore Durometer24 Hour Water AbsorbtionLEDcureBondable SubstratesComments/FeaturesRequest
TDS button TDS
Sample button Sample
90070edge bonding8000-16,000D70-80< 3.0%yesFR4 epoxy board, stainless, plasticsUV/Visible cure, hard, clear, very fast curing, tack-freeRequest sample button TDS button
Elecolit 3012electrical conductivity/die attach/flip-chip bonding/antenna connectionpasteD82n/an/aFR4 epoxy board, glass, metal, ceramic, plasticsone component epoxy, 10 minute thermal cure, silver filled, excellent gap filling properties, dispenses well by valve or screen printingRequest sample button TDS button
Elecolit 3024electrical conductivity/die attach/flip-chip bonding/antenna connection2800D82n/an/aFR4 epoxy board, glass, metal, ceramic, plasticstwo component epoxy, quick low-temp or rapid high-temp snap cure, excellent for bonding heat sensitive componentsRequest sample button TDS button
Elecolit 3025electrical conductivity/die attach/flip-chip bonding/antenna connectionpaste (80,000-90,000)D70-80< 0.5%n/aFR4 epoxy board, glass, metal, ceramic, plastics2 part epoxy, short curing time at high temperatrue, curing at room temperature possible, suitable for heat sensitive substrates,good electrical conductivity, proven in automotive applications Request sample button TDS button
Elecolit 3036electrical conductivity/die attach/flip-chip bonding/antenna connectionpaste (80,000-90,000)D70-80< 0.5%n/aFR4 epoxy board, glass, metal, ceramic, plastics2 part epoxy, short curing time at high temperatrue, curing at room temperature possible, suitable for heat sensitive substrates, medium level electrical conductivityRequest sample button TDS button
Elecolit 3043electrical conductivity/die attach/flip-chip bonding/antenna connection4000-5000D75-85< 0.2%n/aFR4 epoxy board, glass, metal, ceramic, plasticsone component epoxy, refrigerated storage, thermal cure, high purity and low ionic content, fine grade filler for easy dispensing and precise placement, excellent material for antenna printingRequest sample button TDS button
Elecolit 3653electrical conductivity/die attach/flip-chip bonding/antenna connection8000-10,000D60-75< 0.3%n/aFR4 epoxy board, glass, metal, ceramic, plasticsone component epoxy, refrigerated storage, fast thermal cure, flexible, vibration and impact resistant, easily dispensedRequest sample button TDS button
Elecolit 3655electrical conductivity/die attach/flip-chip bonding/antenna connection150,000 - 450,000D75-85< 0.2%n/aFR4 epoxy board, glass, metal, ceramic, plastics, semi-conductorhighly filled material, excellent thermal conductivity, very good electrial conductivity, very small filler grain size, easy dispensable, high Tg and good resistnace after high curing temperatureRequest sample button TDS button
Elecolit 6207thermal conductivity/component bonding9,000-12,000D76< 0.3%n/aFR4 epoxy board, glass, metal, ceramic, plasticstwo part epoxy, room temperature curable, low shrinkage, UL 94 V0 approval, low viscostiy, good open timeRequest sample button TDS button
Elecolit 6601thermal conductivity/component bonding12,000-20,000D80-90< 0.3%n/aFR4 epoxy board, glass, metal,ceramic,plasticsone component, refrigerated storage, excellent flow properties, heat curable, thermally conductive, white color, Max Temp up to 200°CRequest sample button TDS button
Elecolit 6603thermal conductivity/component bonding95,000-115,000D78-88< 0.3%n/aFR4 epoxy board, glass, metal,ceramic,plasticsone component, refrigerated storage, heat curable, slightly flexible, grey color, Max Temp up to 200°CRequest sample button TDS button
Elecolit 6604sensor bonding/ thermal conductivity110,000-140,000< 0.3%n/ametals, glassone component, thermal cure, refrigerated storage, good measured value transmission, low CTE, grey color, Max Temp up to 200°CRequest sample button TDS button
Elecolit 6616thermal conductivity/component bondingpasteD81n/an/aFR4 epoxy board, glass, metal,ceramic,plasticstwo component, 1:1 mix ratio, scratch resistant, high peel strength, vibration and shock resistant, excellent stability during repeated thermal cycling (-50°C / +150°C)Request sample button TDS button
Structalit 5604die attach25,000-40,000D80-90n/an/aFR4 epoxy board, glass, metal,ceramic,plasticsTwo minute thermal cure, withstands thermal shock, dispenses easily with industry-standard equipment, withstands soldering temperatures (270°C, max 5 minutes), red colorRequest sample button TDS button
Structalit 5800encapsulant/bonding7000-15,000D75-80< 0.5%n/aglass,plastics,metal2 component, 1:1 mix ratio, room temperature or 5 minute thermal cure ,low shrink, chemical resistRequest sample button TDS button
Structalit 5893glob top/encapsulant/die attach/bonding6000-10,000D80-90< 0.2%n/aFR4 epoxy board, glass, metal, ceramic, plasticsone component, 3 minute low-temp thermal cure, quartz filled, excellent thermal shock resistance, black colorRequest sample button TDS button
Structalit 5894encapsulant/bonding45,000 - 55,000D75-90< 0.2%n/aFR4 epoxy board, glass, metal, ceramic, plasticsone component, thermal cure, impact resistant, black colorRequest sample button TDS button
Vitralit 2113encapsulating/potting/component bonding19,000-32,000D70-80< 0.2%yesFR4 epoxy board, glass, metal,ceramic,plasticsextremely fast UV/Visible cure, low CTE and shrink, tack-free surface, grey colorRequest sample button TDS button
Vitralit 5607die attach1000-2000D75-90n/anoFR4 epoxy board, glass, metal,ceramic,plasticsUV cure, secondary thermal cure, acrylate base, red color, low shrinkRequest sample button TDS button
Vitralit 6104-VT edge and corner bonding/encapsulating75,000-90,000D45-60< 1.5%yesFR4 epoxy board, glass, metal,ceramic,plasticsfast UV cure, secondary low-temp thermal cure, non-migrating, translucentRequest sample button TDS button
Vitralit 6129thermal conductivity/component bonding30,000-40,000D65-75<0.8%noFR4 epoxy board, glass, metal,ceramic,plasticsmulticure: UV light / thermal / activator, moisture resistant, low shrink, aluminum oxide filled, white colorRequest sample button TDS button
Vitralit 6137thermal conductivity/component bonding40,000-60,000D55-56n/anoFR4 epoxy board, glass, metal,ceramic,plasticsUV cure, secondary thermal cure, flexible, white color, good chemical resistance, excellent thermal conductivity, Request sample button TDS button
Vitralit 6138die attach with spacer and thermal conductivity150-170D55-65n/anoFR4 epoxy board, glass, metal,ceramic,plasticsUV cure, secondary thermal cure, flexible, white color, good chemical resistance, excellent thermal conductivity, creates consistent 40µm space between surfacesRequest sample button TDS button
Vitralit UD 5134encapsulating/potting/component bonding15,000-25,000D70-85< 0.2%yesFR4 epoxy board, glass, metal,ceramic,plasticsextremely fast UV/Visible cure, secondary low-temp thermal cure, low CTE and shrink, tack-free surface, grey colorRequest sample button TDS button

*Note: viscosity variations are typically available, or can be formulated, for all listed products. Please inquire with Panacol-USA Applications Engineering for viscosity ranges not shown in the table.
**Note: modifications can be made to most products in order to meet unique performance requirements. Adding fluorescing properties, color, and secondary curing mechanisms are typical examples of minor modifications. Please contact Panacol-USA Applications Engineering to discuss your specific requirements.

Contact Panacol-USA for more info.