Printed Circuit Board (PCB) and Flex Circuit (FPC) Assembly

Solvent-free, UV or UV/Visible light curable chemistry for (PCB) printed circuit board assembly, (FPC) flex circuit assembly, coating, sealing, potting, encapsulating, corner bonding, edge bonding, die attachment, underfilling and conductive adhesives.

Panacol-USA offers a wide selection of adhesives and coatings that address the challenges of PCB and FPC assembly. Reliability and consistency are designed into each formulation to ensure that manufacturers receive the highest level of product performance.

Included in this selection are Panacol-USA’s LEDcure products. LEDcure products fully cure (harden) in fractions of a second under low intensity UV/Visible or Visible light. They are ideal for pairing with LED light curing equipment. Panacol-USA’s light curable product selection is comprised of acrylates and cationic epoxies. These adhesives and coatings bond extremely well with FR-4 epoxy board, polyimide, polyester, PEEK, ceramic, precious metals, and assorted plastics. Suitable applications include conformal coating, encapsulating, potting, wire tacking and component edge bonding. Coatings and encapsulants specifically recommended for flex circuits offer a cured pliability that equals or exceeds that of the film itself.

Solvent-free, light curable adhesives and coatings from Panacol-USA can be incorporated into existing production processes with a minimum of process modification. The benefits of curing adhesives with UV or UV/Visible light can be dollarized from direct and indirect process cost savings. These can include reduced energy consumption, shorter cycle time, lower WIP and inventory, and possibly a reduction in total floor space which is a premium in cleanroom type environments.

In addition, Panacol-USA offers single and two component adhesives for electrical and thermal conductivity. They can be cured at room temperature or at elevated temperatures for faster curing. These products are filled with metallic or inorganic fillers to create conductive paths for electrical and thermal energy. Conductive adhesives can be used wherever solder is not practical, such as with temperature sensitive substrates. Suitable applications include die-attach, heat sinks, antenna printing, and component grounding.

Panacol-USA’s products for electronic component assembly are formulated in compliance with REACH and RoHS directives. As applicable, individual products are tested and certified to UL/IPC, Halogen-Free, or other industry recognized standards. In all product development, Panacol-USA recognizes its responsibility to produce products in compliance with current and long term global initiatives and directives.

Please open one of the links below to view our selection of PCB/Flex Circuit assembly adhesive products. Or, contact Panacol-USA Application Engineering to speak with a trained specialist who can guide you to a product best suited for your application.

 

Electronic Component Potting

Electronic Component Potting

Two/single component or light curable potting materials that are specifically formulated to act as barriers against contamination, chemicals, moisture, and vibration damage. These materials dispense easily, cure quickly, and provide a protective surface that is dry and tack-free. LEDcure potting materials fully cure in fractions of a second under low intensity LED UV/visible or Visible light during automated production.

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Corner and Edge Bonding, Die Attachment, and Underfilling

Corner and Edge Bonding, Die Attachment, and Underfilling

All of our corner bonding, edge bonding, die attachment and underfilling adhesives can be dispensed manually or using automated dispensing systems. They meet global regulatory standards, including RohS, REACH, UL, and IPC. The adhesives offer high resistance to thermal cycling and are made with low ionic content-less than 10 ppm. Complete assembly solutions can be developed quickly from this diverse grouping.

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Chip-On-Board (COB) Encapsulating – Glob Top and Dam & Fill/Frame & Fill Adhesives

Chip-On-Board (COB) Encapsulating – Glob Top and Dam & Fill/Frame & Fill Adhesives

Glob Top and Dam and Fill/Frame and Fill encapsulation provides protection for individual electronic components attached to PCB’s and FPC’s. Encapsulated components are shielded from environmental stresses, contamination, and mechanical vibration. Tangent’s encapsulating materials serve to neutralize dissimilar Coefficient of Thermal Expansion (CTE) values between the component and board.

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Printed Circuit Board (PCB) and Flexible Printed Circuit (FPC) Conformal Coating

Printed Circuit Board (PCB) and Flexible Printed Circuit (FPC) Conformal Coating

Our solvent-free, uv light curable, acrylated urethane & cationic epoxy conformal coatings are highly flexible after cure making them ideal for flex circuits and PCB’s with delicate components and thin gage wire leads. Cured in seconds with UV/Visible light, these coatings yield dry, tack-free surfaces, high moisture resistance, low Shore A-scale hardness makes them easier to remove for localized repair.

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