Products

Browse Panacol-USA’s adhesives, coatings, and sealants by product type including; Room Temperature & Thermal Cure Epoxies, UV/Visible Cationic Epoxies, Methacrylates, UV and UV/Visible Light Curable Acrylates, High Temperature Adhesives, LEDcure Adhesives, UV Curable Masks for Metal Finishing, Sealants/Coatings, Gasket Seals, Potting Materials, Encapsulants, Thermally Conductive Adhesives and Electrically Conductive Adhesives.

Light Curable Adhesives, Sealants & Masks

Panacol-USA is a research and manufacturing company concentrating on applying the technology of Light-Curable Chemistry. Applications for our products include adhesives, coatings, sealants, masks and encapsulants.

UV and UV/Visible Light Curable Adhesives

UV and UV/Visible Light Curable Adhesives

LED, UV and UV/Visible light curable adhesives are used in a wide range of industrial applications for bonding, sealing, and coating of components and assemblies. These single component formulations are solvent-free, and fully cure (harden) in seconds when exposed to Ultraviolet (UV) or UV/Visible light energy.

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LEDcure UV Adhesives

LEDcure UV Adhesives

Specifically formulated for lower intensity, isolated wavelength curing, LEDcure UV adhesives and sealants deliver all the efficiencies and benefits expected from LED curing including cooler curing temperatures, instant on/off control without shutter mechanisms, and long operating life.

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UV/Visible Cationic Epoxies

UV/Visible Cationic Epoxies

Light curable cationic epoxies from Panacol-Elosol absorb light energy to generate ions that initiate an ionic polymerization process. Advantages of this process are dry, tack-free surface, no shrinkage, low odor, better adhesion, abrasion and chemical resistance, high strength, extreme clarity, and moisture resistance. NEW, LED curable epoxies are now available!

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Room Temperature & Thermal Cure Epoxies

Room Temperature & Thermal Cure Epoxies

Room temperature and thermal cure epoxies from Panacol-Elosol. Structalit epoxies are high performance adhesives, delivering superior strength, thermal stability, and chemical resistance. Elecolit epoxies combine thermal and electrical conductivity with excellent bond strength.

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Electrically Conductive Adhesives

Electrically Conductive Adhesives

Electrically conductive adhesives (Elecolit brand from Panacol-Elosol) for die bonding, underfilling, antennae printing, flip-chips, LCD, and flex circuit assembly. Elecolit electrically conductive adhesives include thermally curable one and two-component products and a UV light curable adhesive, anisotropic adhesive series.

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Thermally Conductive Adhesives

Thermally Conductive Adhesives

Thermally conductive adhesives will channel heat from the bonded component to the attached substrate that functions as a heat sink or dissipater. Thermally conductive epoxies from Panacol-Elosol are available in electrically conductive or non-conductive, one and two part epoxies, UV cure and thermal cure.

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High Strength (Structural)

High Strength (Structural)

The Structalit® products are one and two-component multi-purpose adhesives that provide maximum bond strength and protection. A variety of Structalit adhesives are available for applications that include metal-to-metal bonding, ferrite bonding, temperature resistant plastic bonding, and component encapsulation..

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High Temperature Adhesives

High Temperature Adhesives

For bonding applications involving operating temperatures ranging from 300°C to 1500°C, Cerastil brand adhesives from Panacol are formulated from inorganic materials of high purity, which allow them to be thermally stable in high heat environments. Several grades are available for high strength bonding of quartz, ceramic, glass, and metal.

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Methacrylates

Methacrylates

Penloc GT methacrylate adhesives are two-component, acrylate based structural adhesives. The typical mix ratio of 1:1 means simple, less costly dispensing tools and systems, products can be mixed by a static mixing tip when dispensing, or dispense unmixed to apply as a bead-on-bead.

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Form and Cure-In-Place Gaskets, (FIP/CIP)

Form and Cure-In-Place Gaskets, (FIP/CIP)

UV or UV/Visible light curable chemistry for Form and Cure-In-Place Gaskets, (FIP/CIP) dispensed as a flowable liquid or non-migrating gel, exactly where a gasket is required, and then cured (hardened) in seconds as part of a continuous in-line production process.

Cured properties: moisture resistance, low shrinkage, invulnerability to thermal cycling, high cohesive strength, and surfaces that range from tack-free to sticky, (like a PSA).

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UV Curable Masks for Metal Finishing

UV Curable Masks for Metal Finishing

Tangent UV light curable masking products are easily applied and cured (hardened) in seconds with a UV light source. A single coat provides consistent protection from high impact particulate, hot acids, alkali solutions, plating, etc. These UV masking materials are available in many viscosities to accommodate the wide variety of applications. Removal is accomplished by simple peel, hot water dip and peel, or through incineration. Components are residue-free after removal of the UV mask.

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Sealants/Coatings

Sealants/Coatings

Our UV light curable sealants and conformal coatings are easily integrated in automated production processes for printed circuit board (PCB) and flex circuits (FPC) assembly. Cured properties range from soft/ highly flexible to hard/rigid. Tangent sealants and coatings provide long-lasting and reliable protection for components operating in harsh environments. Coated surfaces are insulated from high humidity, airborne particulates, chemicals, abrasion, insects, and vibration.

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UV Gaskets and Seals

UV Gaskets and Seals

UV light curable Form-In-Place gaskets are dispensed as flowable liquids or non-migrating gels, exactly where a gasket is required, and can be cured (hardened) in seconds as part of continuous in-line production process. Tangent’s Stay-In-Place gasket technology produces gasket materials that adhere to the surfaces they are cured upon, permitting immediate handling and continuous production.

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Potting Materials

Potting Materials

Tangent’s potting materials are formulated to protect electronic and electrical components from thermal shock, vibration, moisture, and other environmental elements. To accommodate the broad range of potting applications, Tangent offers UV and visible light curable products, two component compounds, and thermal curing materials. The potting materials can be optically clear, or completely opaque to mask the surface below.

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Encapsulants

Encapsulants

Encapsulants and encapsulating adhesives provide environmental protection for electronic components such as diodes, capacitors, and integrated circuits (IC), as well as wire leads and other fragile connectors. Our encapsulant’s have high ionic purity, and cured properties include moisture resistance, invulnerability to thermocycling, low shrink, and flexibility from a low modulus value. Low shrink and flexibility are significant as the encapsulant also functions as a strain relief for fine wire leads.

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