Maximum Strength Multi-Purpose Adhesives
Structalit® multi-purpose single and two-component adhesives develop high strength bonds with many substrates that include metals, ceramic, glass, and FR4 epoxy board. They offer high resistance to abrasion, chemicals, and elevated temperatures. Structalit adhesives harden quickly after mixing or placing them in a curing oven.
Unique Structalit formulations are available to PCB and Smart Card assembly. Black or grey in color, these single component adhesives can be used as glob tops or encapsulants. They will cure in minutes when thermally cured in an oven. These adhesives can also be used as potting materials for various electronic components.
For more information click here and download the Structalit® brochure.
|Product Number||Suitable Applications||Viscosity cP mPa||Shore Durometer||24 Hour Water Absorbtion||Color||Bondable Substrates||Comments/Features||Request|
|encapsulant/bonding||7000-15,000||D75-80||< 0.5%||transparent/slight yellow tint||glass,plastics,metal||2 component, 1:1 mix ratio, room temperature or 5 minute thermal cure ,low shrink, chemical resist|
|bonding materials of similar CTE||20,000-25,000||D85-95||< 0.3%||clear||metals, glass, plastic||one component, 15 minute thermal cure, unfilled|
|magnet (ferrite) bonding, metal bonding||28,000-38,000||D65-75||< 0.5%||amber||ferrite, metals||one component, 15 minute thermal cure, elastomer modified for high impact resistance, excellent peel strength|
|bonding metals, plastics||3,000 - 5,000||80 - 90||< 0.5%||transparent, amber||wide range of materials including metals (alumina, steel and stainless steel) and many plastics||two part, thermal curing epoxy adhesive|
|potting/encapsulating||30,000-45,000||D80-90||< 0.2%||grey||FR4 epoxy board, glass, metal, ceramic, plastics||one component epoxy, thermal cure, chemical resistant, limited flow, max operating temperature up to 200°C, Max Temp up to 200°C|
Contact Panacol-USA for more info.