Room Temperature & Thermal Cure Epoxies

Room temperature and thermal cure epoxies from Panacol-Elosol. Structalit epoxies are high performance adhesives, delivering superior strength, thermal stability, and chemical resistance. Elecolit epoxies combine thermal and electrical conductivity with excellent bond strength.

Epoxies continue to evolve and improve. New single and two-component epoxy introductions are stronger, faster curing, and easier to work with. As an alternative to light curable adhesives, epoxies overcome challenges presented by shadowed bond lines and opaque substrates. They exhibit minimal shrinkage, and offer superior chemical and environmental resistance. Their non-photonic curing mechanisms allow them to be opaque in color, and they can be filled with thermally and electrically conductive materials.

As their exclusive distributor for the Americas, Panacol-USA offers room temperature and thermally curable epoxies from Panacol-Elosol. With an expertise in epoxy development, Panacol-Elosol GmbH is part of the Honle Group headquartered in Germany. They have been formulating and manufacturing adhesives for over 30 years. Panacol epoxies are packaged under the brand names of Structalit® and Elecolit®.

Structalit® epoxies are high performance adhesives, delivering superior strength, thermal stability, and chemical resistance. The epoxies form incredibly high strength structural bonds that are demanded in panel assembly, frame attachment, and ferrite bonding. In addition, select products are ideal for sealing and encapsulating (glob top) electronic and electrical components such as smart cards. They are also ideal for potting and casting applications. Structalit® products are available as single component or two component systems. The single component adhesives offer easy dispensing and fast, thermal curing. Two-component epoxy systems can be cured at room temperature or accelerated with heat. Various pot-life schedules are available to accommodate the infinite number of global production processes.

Elecolit® epoxies combine thermal and electrical conductivity with excellent bond strength. The electrically conductive epoxies are ideal for antenna printing, die bonding, and other electronic assembly associated with PCB, FPC, and LCD production. The thermally conductive epoxies facilitate heat transfer, and are typically used to affix heat sinks and power modules.

Electrical conductivity is typically achieved by filling the adhesive with metallic materials such as gold, silver, or nickel. Metallic fillers also offer the best thermal conductivity, which enables the electrically conductive epoxies to serve a dual function. However, if thermal conductivity is required without the possibility of electrical conductivity, Elecolit® offers epoxies containing non-metallic fillers. Elecolit conductive epoxies are available as one or two component systems.

View the Structalit® and Elecolit® epoxy products listed below for a possible candidate for your application. Please contact Tangent to confirm your product selection and to secure additional application assistance, including samples and process recommendations. In the event that these standard products do not satisfactorily address your performance requirements, Tangent will investigate other solutions that include development of adhesive specifically tailored to the complexity of your application.

Product NumberSuitable ApplicationsViscosity cP mPaShore Durometer24 Hour Water AbsorbtionLEDcureBondable SubstratesComments/FeaturesRequest
TDS button TDS
Sample button Sample
Elecolit 3012electrical conductivity/die attach/flip-chip bonding/antenna connectionpasteD82n/an/aFR4 epoxy board, glass, metal, ceramic, plasticsone component epoxy, 10 minute thermal cure, silver filled, excellent gap filling properties, dispenses well by valve or screen printingRequest sample button TDS button
Elecolit 3024electrical conductivity/die attach/flip-chip bonding/antenna connection2800D82n/an/aFR4 epoxy board, glass, metal, ceramic, plasticstwo component epoxy, quick low-temp or rapid high-temp snap cure, excellent for bonding heat sensitive componentsRequest sample button TDS button
Elecolit 3025electrical conductivity/die attach/flip-chip bonding/antenna connectionpaste (80,000-90,000)D70-80< 0.5%n/aFR4 epoxy board, glass, metal, ceramic, plastics2 part epoxy, short curing time at high temperatrue, curing at room temperature possible, suitable for heat sensitive substrates,good electrical conductivity, proven in automotive applications Request sample button TDS button
Elecolit 3036electrical conductivity/die attach/flip-chip bonding/antenna connectionpaste (80,000-90,000)D70-80< 0.5%n/aFR4 epoxy board, glass, metal, ceramic, plastics2 part epoxy, short curing time at high temperatrue, curing at room temperature possible, suitable for heat sensitive substrates, medium level electrical conductivityRequest sample button TDS button
Elecolit 3043electrical conductivity/die attach/flip-chip bonding/antenna connection4000-5000D75-85< 0.2%n/aFR4 epoxy board, glass, metal, ceramic, plasticsone component epoxy, refrigerated storage, thermal cure, high purity and low ionic content, fine grade filler for easy dispensing and precise placement, excellent material for antenna printingRequest sample button TDS button
Elecolit 3653electrical conductivity/die attach/flip-chip bonding/antenna connection8000-10,000D60-75< 0.3%n/aFR4 epoxy board, glass, metal, ceramic, plasticsone component epoxy, refrigerated storage, fast thermal cure, flexible, vibration and impact resistant, easily dispensedRequest sample button TDS button
Elecolit 3655electrical conductivity/die attach/flip-chip bonding/antenna connection150,000 - 450,000D75-85< 0.2%n/aFR4 epoxy board, glass, metal, ceramic, plastics, semi-conductorhighly filled material, excellent thermal conductivity, very good electrial conductivity, very small filler grain size, easy dispensable, high Tg and good resistnace after high curing temperatureRequest sample button TDS button
Elecolit 6207thermal conductivity/component bonding9,000-12,000D76< 0.3%n/aFR4 epoxy board, glass, metal, ceramic, plasticstwo part epoxy, room temperature curable, low shrinkage, UL 94 V0 approval, low viscostiy, good open timeRequest sample button TDS button
Elecolit 6601thermal conductivity/component bonding12,000-20,000D80-90< 0.3%n/aFR4 epoxy board, glass, metal,ceramic,plasticsone component, refrigerated storage, excellent flow properties, heat curable, thermally conductive, white color, Max Temp up to 200°CRequest sample button TDS button
Elecolit 6603thermal conductivity/component bonding95,000-115,000D78-88< 0.3%n/aFR4 epoxy board, glass, metal,ceramic,plasticsone component, refrigerated storage, heat curable, slightly flexible, grey color, Max Temp up to 200°CRequest sample button TDS button
Elecolit 6604sensor bonding/ thermal conductivity110,000-140,000< 0.3%n/ametals, glassone component, thermal cure, refrigerated storage, good measured value transmission, low CTE, grey color, Max Temp up to 200°CRequest sample button TDS button
Elecolit 6616thermal conductivity/component bondingpasteD81n/an/aFR4 epoxy board, glass, metal,ceramic,plasticstwo component, 1:1 mix ratio, scratch resistant, high peel strength, vibration and shock resistant, excellent stability during repeated thermal cycling (-50°C / +150°C)Request sample button TDS button
Structalit 5604die attach25,000-40,000D80-90n/an/aFR4 epoxy board, glass, metal,ceramic,plasticsTwo minute thermal cure, withstands thermal shock, dispenses easily with industry-standard equipment, withstands soldering temperatures (270°C, max 5 minutes), red colorRequest sample button TDS button
Structalit 5800encapsulant/bonding7000-15,000D75-80< 0.5%n/aglass,plastics,metal2 component, 1:1 mix ratio, room temperature or 5 minute thermal cure ,low shrink, chemical resistRequest sample button TDS button
Structalit 5890glob top/encapsulant/dam material/ bonding300k-400kD80-90< 0.1%n/aFR4 epoxy board, glass, metal, ceramic, plasticsone component, 3 minute low-temp thermal cure, excellent thermally conductivity, black colorRequest sample button TDS button
Structalit 5891glob top/encapsulant/dam material/ bonding300,000-400,000D80-90< 0.2%n/aFR4 epoxy board, glass, metal, ceramic, plasticsone component, 3 minute low-temp thermal cure, quartz filled, excellent thermal shock resistance, black colorRequest sample button TDS button
Structalit 5893glob top/encapsulant/die attach/bonding6000-10,000D80-90< 0.2%n/aFR4 epoxy board, glass, metal, ceramic, plasticsone component, 3 minute low-temp thermal cure, quartz filled, excellent thermal shock resistance, black colorRequest sample button TDS button
Structalit 5894encapsulant/bonding45,000 - 55,000D75-90< 0.2%n/aFR4 epoxy board, glass, metal, ceramic, plasticsone component, thermal cure, impact resistant, black colorRequest sample button TDS button
Structalit 8801 potting/encapsulating30,000-45,000D80-90< 0.2%n/aFR4 epoxy board, glass, metal, ceramic, plasticsone component epoxy, thermal cure, chemical resistant, limited flow, max operating temperature up to 200°C, Max Temp up to 200°CRequest sample button TDS button
Structalit 8804 potting/encapsulating30,000-45,000D80-90< 0.2%n/aFR4 epoxy board, glass, metal, ceramic, plasticsone component epoxy, thermal cure, chemical resistant, medium flow, grey color, max operating temperature up to 200°C, grey color, Max Temp up to 200°CRequest sample button TDS button
Structalit 8805 potting/encapsulating30,000-45,000D80-90< 0.2%n/aFR4 epoxy board, glass, metal, ceramic, plasticsone component epoxy, thermal cure, chemical resistant, long flow for cavity filling, max operating temperature up to 200°C, grey color, Max Temp up to 200°CRequest sample button TDS button
Structalit 8811 potting/encapsulating30,000-45,000D80-90< 0.2%n/aFR4 epoxy board, glass, metal, ceramic, plasticsone component epoxy, thermal cure, chemical resistant, limited flow, max operating temperature up to 200°C , black color, Max Temp up to 200°CRequest sample button TDS button

*Note: viscosity variations are typically available, or can be formulated, for all listed products. Please inquire with Panacol-USA Applications Engineering for viscosity ranges not shown in the table.
**Note: modifications can be made to most products in order to meet unique performance requirements. Adding fluorescing properties, color, and secondary curing mechanisms are typical examples of minor modifications. Please contact Panacol-USA Applications Engineering to discuss your specific requirements.

Contact Panacol-USA for more info.