Thermally Conductive Adhesives

Thermally conductive adhesives will channel heat from the bonded component to the attached substrate that functions as a heat sink or dissipater. Thermally conductive epoxies from Panacol-Elosol are available in electrically conductive or non-conductive, one and two part epoxies, UV cure and thermal cure.

The ability of an electronic or electrical component to dissipate heat has a direct impact on its reliability and longevity. Heat dissipation can be improved in many component assembly applications by incorporating thermally conductive adhesives as bonding agents. Thermally conductive adhesives will channel heat from the bonded component to the attached substrate that functions as a heat sink or dissipater. Electrically conductive materials with metallic fillers are excellent at conducting heat due to their metal content. However, this also creates electrical conductivity, which may or may not be desirable. If only thermal conductivity is needed, non-metallic filled products should be utilized.

As their exclusive distributor for the Americas, Tangent offers thermally conductive epoxies from Panacol-Elosol. Panacol-Elosol GmbH is a member of the Honle Group headquartered in Germany, and has been formulating and manufacturing adhesives for over 30 years.

View the thermally conductive products listed below for a possible candidate for your application. Please contact Tangent to confirm your product selection and to secure additional application assistance, including samples and process recommendations.

Product NumberSuitable ApplicationsViscosity cP mPaShore Durometer24 Hour Water AbsorbtionLEDcureBondable SubstratesComments/FeaturesRequest
TDS button TDS
Sample button Sample
Elecolit 3655electrical conductivity/die attach/flip-chip bonding/antenna connection150,000 - 450,000D75-85< 0.2%n/aFR4 epoxy board, glass, metal, ceramic, plastics, semi-conductorhighly filled material, excellent thermal conductivity, very good electrial conductivity, very small filler grain size, easy dispensable, high Tg and good resistnace after high curing temperatureRequest sample button TDS button
Elecolit 6207thermal conductivity/component bonding9,000-12,000D76< 0.3%n/aFR4 epoxy board, glass, metal, ceramic, plasticstwo part epoxy, room temperature curable, low shrinkage, UL 94 V0 approval, low viscostiy, good open timeRequest sample button TDS button
Elecolit 6601thermal conductivity/component bonding12,000-20,000D80-90< 0.3%n/aFR4 epoxy board, glass, metal,ceramic,plasticsone component, refrigerated storage, excellent flow properties, heat curable, thermally conductive, white color, Max Temp up to 200°CRequest sample button TDS button
Elecolit 6603thermal conductivity/component bonding95,000-115,000D78-88< 0.3%n/aFR4 epoxy board, glass, metal,ceramic,plasticsone component, refrigerated storage, heat curable, slightly flexible, grey color, Max Temp up to 200°CRequest sample button TDS button
Elecolit 6604sensor bonding/ thermal conductivity110,000-140,000< 0.3%n/ametals, glassone component, thermal cure, refrigerated storage, good measured value transmission, low CTE, grey color, Max Temp up to 200°CRequest sample button TDS button
Elecolit 6616thermal conductivity/component bondingpasteD81n/an/aFR4 epoxy board, glass, metal,ceramic,plasticstwo component, 1:1 mix ratio, scratch resistant, high peel strength, vibration and shock resistant, excellent stability during repeated thermal cycling (-50°C / +150°C)Request sample button TDS button
Vitralit 1671glob top/dam material250,000-300,000D80-90< 0.3%noFR4 epoxy board, glass, metal, ceramic, plasticsUV cure, cationic epoxy, good heat conductivity, moisture resistant, high purity and low ionic content, high adhesion, resistant to thermal cyclingRequest sample button TDS button
Vitralit 6129thermal conductivity/component bonding30,000-40,000D65-75<0.8%noFR4 epoxy board, glass, metal,ceramic,plasticsmulticure: UV light / thermal / activator, moisture resistant, low shrink, aluminum oxide filled, white colorRequest sample button TDS button
Vitralit 6137thermal conductivity/component bonding40,000-60,000D55-56n/anoFR4 epoxy board, glass, metal,ceramic,plasticsUV cure, secondary thermal cure, flexible, white color, good chemical resistance, excellent thermal conductivity, Request sample button TDS button
Vitralit 6138die attach with spacer and thermal conductivity150-170D55-65n/anoFR4 epoxy board, glass, metal,ceramic,plasticsUV cure, secondary thermal cure, flexible, white color, good chemical resistance, excellent thermal conductivity, creates consistent 40µm space between surfacesRequest sample button TDS button

*Note: viscosity variations are typically available, or can be formulated, for all listed products. Please inquire with Panacol-USA Applications Engineering for viscosity ranges not shown in the table.
**Note: modifications can be made to most products in order to meet unique performance requirements. Adding fluorescing properties, color, and secondary curing mechanisms are typical examples of minor modifications. Please contact Panacol-USA Applications Engineering to discuss your specific requirements.

Contact Panacol-USA for more info.