Encapsulants

Encapsulants and encapsulating adhesives provide environmental protection for electronic components such as diodes, capacitors, and integrated circuits (IC), as well as wire leads and other fragile connectors. Our encapsulant’s have high ionic purity, and cured properties include moisture resistance, invulnerability to thermocycling, low shrink, and flexibility from a low modulus value. Low shrink and flexibility are significant as the encapsulant also functions as a strain relief for fine wire leads.

Similar to sealants and coatings, encapsulants provide environmental protection for individual electronic components such as diodes, capacitors, and integrated circuits (IC), as well as wire leads and other fragile connectors. The encapsulant’s composition must reflect high ionic purity, and preferred cured properties include moisture resistance, invulnerability to thermocycling, low shrink, and flexibility from a low modulus value. Low shrink and flexibility are significant as the encapsulant also functions as a strain relief for fine wire leads. Lower stress minimizes the risk of wire breakage.

Encapsulants offered by Tangent have been formulated with all these desirable properties in mind. Tangent’s line of encapsulants offers excellent adhesion to substrates associated with PCB and FPC assembly, including polyimide, metals, FR-4 (glass-epoxy), PET, polycarbonate, ceramic, and glass. They are offered in a range of viscosities to better support numerous component geometries. For example, in order for the encapsulant to create a uniform coating (shell) on sharp-edged components, it should generally be higher in viscosity and thixotropic.

As their exclusive distributor for the Americas, Tangent offers encapsulants from Panacol, under the Structalit® and Elecolit® brand names. Panacol-Elosol GmbH is a member of the Honle Group headquartered in Germany, and has been formulating and manufacturing adhesives for over 30 years.

View the Encapsulant products listed below for a possible candidate for your application. Please contact Tangent to confirm your product selection and to secure additional application assistance, including samples and process recommendations. In the event that these standard products do not satisfactorily address your performance requirements, Tangent will investigate other solutions that include development of adhesive specifically tailored to the complexity of your application.

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Product NumberSuitable ApplicationsViscosity cP mPaShore Durometer24 Hour Water AbsorbtionLEDcureBondable SubstratesComments/FeaturesRequest
TDS button TDS
Sample button Sample
90008flex circuits/encapsulation1000-2000D40-50< 2.0%nopolyester, PVC, PC, Glass, metalsUV/Visible cure, very flexible, tack free surfaceRequest sample button TDS button
90013encapsulation900-1500D35-50< 1.0%yesplastics, ceramic, glass,stainless steelUV/Visible cure,flexible, self-leveling, tack-free surfaceRequest sample button TDS button
90015flex circuits/encapsulation250-500A45-65< 1.0%yesplastics, ceramic, glass,stainless steelUV/Visible cure, soft, flexible, tack-free surface, very fast curingRequest sample button TDS button
90086flexcircuits/encapsulation/potting500-800A10-20< 1.0%yesplastics, ceramic, glass,stainless steelUV/Visible cure, very soft, flexibleRequest sample button TDS button
90830flex circuits/encapsulation900-1500A35-50< 4.0%yesmost plastics, ceramic, glass,stainless steelUV/Visible cure,soft, very flexible, tack free surfaceRequest sample button TDS button
Structalit 5800encapsulant/bonding7000-15,000D75-80< 0.5%n/aglass,plastics,metal2 component, 1:1 mix ratio, room temperature or 5 minute thermal cure ,low shrink, chemical resistRequest sample button TDS button
Structalit 5890glob top/encapsulant/dam material/ bonding300k-400kD80-90< 0.1%n/aFR4 epoxy board, glass, metal, ceramic, plasticsone component, 3 minute low-temp thermal cure, excellent thermally conductivity, black colorRequest sample button TDS button
Structalit 5891glob top/encapsulant/dam material/ bonding300,000-400,000D80-90< 0.2%n/aFR4 epoxy board, glass, metal, ceramic, plasticsone component, 3 minute low-temp thermal cure, quartz filled, excellent thermal shock resistance, black colorRequest sample button TDS button
Structalit 5893glob top/encapsulant/die attach/bonding6000-10,000D80-90< 0.2%n/aFR4 epoxy board, glass, metal, ceramic, plasticsone component, 3 minute low-temp thermal cure, quartz filled, excellent thermal shock resistance, black colorRequest sample button TDS button
Structalit 5894encapsulant/bonding45,000 - 55,000D75-90< 0.2%n/aFR4 epoxy board, glass, metal, ceramic, plasticsone component, thermal cure, impact resistant, black colorRequest sample button TDS button
Structalit 8801 potting/encapsulating30,000-45,000D80-90< 0.2%n/aFR4 epoxy board, glass, metal, ceramic, plasticsone component epoxy, thermal cure, chemical resistant, limited flow, max operating temperature up to 200°C, Max Temp up to 200°CRequest sample button TDS button
Structalit 8804 potting/encapsulating30,000-45,000D80-90< 0.2%n/aFR4 epoxy board, glass, metal, ceramic, plasticsone component epoxy, thermal cure, chemical resistant, medium flow, grey color, max operating temperature up to 200°C, grey color, Max Temp up to 200°CRequest sample button TDS button
Structalit 8805 potting/encapsulating30,000-45,000D80-90< 0.2%n/aFR4 epoxy board, glass, metal, ceramic, plasticsone component epoxy, thermal cure, chemical resistant, long flow for cavity filling, max operating temperature up to 200°C, grey color, Max Temp up to 200°CRequest sample button TDS button
Structalit 8811 potting/encapsulating30,000-45,000D80-90< 0.2%n/aFR4 epoxy board, glass, metal, ceramic, plasticsone component epoxy, thermal cure, chemical resistant, limited flow, max operating temperature up to 200°C , black color, Max Temp up to 200°CRequest sample button TDS button
Vitralit 1605encapsulating300-500D80-90< 0.2%yes, limitedglass lens, metal, ceramiclight curable, cationic epoxy, high optical clarity, low viscosity, easy to dispense, fast curing, high Tg, resistant to thermal cycling, no outgassingRequest sample button TDS button
Vitralit 1650glob top/encapsulant6000-9000D70-80< 0.2%yesFR4 epoxy board, glass, metal, ceramic, plasticsUV cure, cationic epoxy, high purity and low ionic content, high adhesion, resistant to thermal cycling, grey colorRequest sample button TDS button
Vitralit 1655encapsulating200-400A70-80< 0.35%noFR4 epoxy board, glass, metal, plasticUV cationic curable epoxy, clear and flexible , resistant to thermal shock, excellent for substrates with mismatched CTE, low viscosity, can be used as an underfillRequest sample button TDS button
Vitralit 1657glob top/encapsulant/flex circuit assembly120,000-130,000D62-68< 0.8%noflex circuit film, FR4 epoxy board, glass, metal, ceramic, plasticsUV cure, cationic epoxy, flexible, high purity and low ionic content, high adhesion, resistant to thermal cycling, light grey colorRequest sample button TDS button
Vitralit 1680fill/encapsulate6,000-9,000D70-80< 0.2%noFR4 epoxy board, glass, metal, ceramic, plastics, smart cardUV cure, cationic epoxy, high purity and low ionic content, high adhesion, resistant to thermal cycling, grey colorRequest sample button TDS button
Vitralit 1688fill/encapsulate3,000-4,000D70-80< 0.2%noFR4 epoxy board, glass, metal, ceramic, plastics, smart cardUV cure, cationic epoxy, high purity and low ionic content, high adhesion, resistant to thermal cycling, grey colorRequest sample button TDS button
Vitralit 2113encapsulating/potting/component bonding19,000-32,000D70-80< 0.2%yesFR4 epoxy board, glass, metal,ceramic,plasticsextremely fast UV/Visible cure, low CTE and shrink, tack-free surface, grey colorRequest sample button TDS button
Vitralit 6104-VT edge and corner bonding/encapsulating75,000-90,000D45-60< 1.5%yesFR4 epoxy board, glass, metal,ceramic,plasticsfast UV cure, secondary low-temp thermal cure, non-migrating, translucentRequest sample button TDS button
Vitralit UD 5134encapsulating/potting/component bonding15,000-25,000D70-85< 0.2%yesFR4 epoxy board, glass, metal,ceramic,plasticsextremely fast UV/Visible cure, secondary low-temp thermal cure, low CTE and shrink, tack-free surface, grey colorRequest sample button TDS button

*Note: viscosity variations are typically available, or can be formulated, for all listed products. Please inquire with Panacol-USA Applications Engineering for viscosity ranges not shown in the table.
**Note: modifications can be made to most products in order to meet unique performance requirements. Adding fluorescing properties, color, and secondary curing mechanisms are typical examples of minor modifications. Please contact Panacol-USA Applications Engineering to discuss your specific requirements.

Contact Panacol-USA for more info.