Corner and Edge Bonding, Die Attachment, Underfilling

Printed Circuit Board (PCB) and Flexible Printed Circuit (FPC) assembly processes are continuously changing to accommodate component modifications that increase speed and decrease package size. These changes have a direct impact on the adhesives used in component attachment. Adhesive manufacturers must constantly be in synch with new technology, and provide products that optimize manufacturing processes and the operating performance of the circuit.

Panacol-USA offers a broad selection of adhesive products to address these challenges. They include light curable acrylics and cationic epoxies, as well as room temperature and thermal curing epoxies. Complete assembly solutions can be developed quickly from this diverse grouping.

Corner and edge bonding of BGA and similar surface mounted components is efficiently accomplished using Panacol-USA’s selection of light curable adhesives. This grouping includes our exclusive LED curable adhesive technology. LED curable products from Panacol-USA fully cure in seconds under low intensity UV or Visible light. They are ideal for pairing with our Honle LED curing equipment. These high strength, flexible adhesives can minimize vibration and thermal interconnect stresses between the circuit board and BGA.

A red colored adhesive is applied as corner bonding to make a contrast with the green PCB board for enhanced process control

Die attachment and flip-chip underfilling adhesives are also available from Panacol-USA. UV Light/thermal curable acrylates, cationic epoxies, and conductives deliver the properties demanded from these applications. All of our die attachment and underfilling adhesives can be dispensed manually or using automated dispensing systems. They are formulated to meet global regulatory standards, including RohS, REACH, UL, and IPC. These electronic grade  adhesives offer high resistance to thermal cycling and are made with low ionic content (less than 10 ppm). The consistent performance of this adhesive selection will reduce flip-chip thermal cycling stresses, ultimately increasing the fatigue life of the entire circuit assembly.

View the adhesive selections listed below for possible candidates for your corner bonding, edge bonding, die attachment, and underfilling applications. 

Adhesive Application Viscosity [mPas] Base Curing* Properties
Vitralit® 2655 flip chip underfill 150-300 epoxy UV
secondary heat cure
flexible
capillary flow
high ion purity,
Vitralit® 2667 flip chip underfill 3,000-5,000 epoxy UV
secondary heat cure
Low thermal expansion
low ion content
Elecolit® 3063 LCD bonding
bonding flexible conductors
150,000-190,000 acrylate UV + pressure
VIS + pressure
electrically conductive (ACA)
Elecolit® 3064 LCD bonding
bonding flexible conductors
gel-like acrylate UV + pressure
VIS + pressure
electrically conductive (ACA)
Elecolit® 3065 bonding flexible circuits
display and touchscreen sealing
paste-like acrylate UV + pressure
VIS + pressure
thermal
electrically conductive (ACA)
transparent brownish color
Elecolit® 327 bonding electroconductive parts paste-like polyimid thermal electrically conductive (ICA)
thermally conductive high temperature resistant up to 275°C
Elecolit® 3653 bonding electroconductive parts
ideal for parts subjected to high vibrations
8,000-13,000 epoxy thermal electrically conductive (ICA)
thermally conductive
Elecolit® 3655 LED die attach 5,000-15,000 epoxy thermal electrically conductive (ICA)
thermally conductive
thixotropic
silver color
Elecolit® 3661 bonding flexible interconnect devices 20.000-40.000 epoxy thermal electrically conductive (ICA)
thermally conductive
stable
flexible
Vitralit® 6104 VT encapsulation of electronic components
SMD assembly
attaching components on PCBs
automotive, aerospace
80,000-90,000 acrylate UV
secondary heat cure
Very high adhesion to metals and sintered materials
ideal for bonding large components on circuit boards (corner bonding)
Vitralit® UD 2018 attaching components on PCBs shear thinning epoxy UV
secondary heat cure
Resistant to temperature cycles
low shrinkage
low thermal expansion coefficient
red color
pink fluorescent
Vitralit® UV 2115 lens bonding cement
attaching components on PCBs
SMD assembly
plastic bonding
potting material
automotive, aerospace
20,000-30,000 hybrid UV
VIS
Acrylate hybrid
superior strength
low thermal expansion
low shrinkage
impact resistant
resistant to soldering stress
paste-like
stable and high viscous
Structalit® 3060 attaching components on PCBs
SMD assembly
die attach
smart card
plastic bonding
30,000-40,000 epoxy thermal Fast curing
fixing components on PCBs
corner bonding
glob top
SMD applications
Structalit® 5604 attaching components on PCBs
SMD assembly
die attach
smart card
plastic bonding
25,000-40,000 epoxy thermal Fast curing
red color
fixing components on PCBs
SMD applications
Structalit® 5610 attaching components on PCBs
SMD assembly
22,000-40,000 epoxy thermal very fast curing even at low temperatures
high temperature resistance
red color
Elecolit® 3656 die attach
semiconductor
LED applications
40,000-60,000 epoxy thermal silver-containing
small grain size
high filling density
low ion content
Vitralit® 90070 Edge bonding

*UV = 320 - 390 nm          VIS = 405 nm

To download the technical datasheets (TDS) please click on the adhesive name.