Thermally Conductive Adhesives
The ability of an electronic or electrical component to dissipate heat has a direct impact on its reliability and longevity. Heat dissipation can be improved in many component assembly applications by incorporating thermally conductive adhesives as bonding agents. Thermally conductive adhesives will channel heat from the bonded component to the attached substrate that functions as a heat sink or dissipater. Electrically conductive materials with metallic fillers are excellent at conducting heat due to their metal content. However, this also creates electrical conductivity, which may or may not be desirable. If only thermal conductivity is needed, non-metallic filled products should be utilized.
Thermal adhesives from Panacol-USA are available under the Elecolit® and Vitralit® brands:
- Elecolit® thermal adhesives are epoxy resin-based single- and two-component adhesives, which are thermally curing and have a high temperature resistance of up to 200°C
- Vitralit® thermal adhesives are uv curing acrylate-based adhesives
The table below lists a selection of thermally conductive adhesives from Panacol-USA. Further products and custom solutions are available on request. Please contact Panacol-USA to confirm your product selection and to secure additional application assistance, including samples and process recommendations.
To download the technical datasheets (TDS) please click on the adhesive name.
Thermally conductive adhesive is used for bonding heat sinks on PCBs
| Conductive Adhesive | Application | Viscosity [mPas] | Base | Curing* | Properties |
|---|---|---|---|---|---|
| Elecolit® 6601 |
Heat sink bonding Sensor bonding Potting |
12,000-20,000 (LVT, 25 °C, Sp. 4/6 rpm) | epoxy | thermal |
thermally conductive, solvent-free, white color, excellent bonding to metals, very good flow properties |
| Elecolit® 6603 |
Magnet bonding Heat sink bonding Potting Thermal management |
95 000 - 115 000 (LVT, 25 °C, Sp. 4/3 rpm) | epoxy | thermal |
thermally conductive grey color very good adhesion to metal excellent flow properties |
| Elecolit® 6607 |
Heat Sink Bonding Thermal Management Potting Die Attach |
50 000 - 65 000 (Rheometer 25°C, 5s^-1) | epoxy | thermal |
Thermally conductive, grey color Excellent metal bonding Cures at low temperatures |
| Elecolit® 6616 | heat sink bonding | 50,000-120,000 (Rheometer, 25 °C, 10s^-1) | 2 component epoxy |
thermal room temperature |
thermally conductive black color |
| Vitralit® 6129 | various application for electronics and PCB assembly | 4,000-7,000 | acrylate |
UV secondary heat cure |
white color very high resistance to heat and chemicals very good thermal conductivity |
*UV = 320 - 390 nm
