Electronic Component Potting

Electronic components inherently require protection from moisture and mechanical damage. For this reason, they are typically sealed with materials offering protective properties. These processes take place prior to next level of PCB assembly. Components such as capacitors, switches, and relays are typically designed with shallow cavities for containment, so that low viscosity potting materials may be dispensed quickly during automated production.

Panacol-USA offers single component, light curable potting materials of the Vitralit® brand, or thermally curing potting compounds of the Structalit® line. Both adhesive brands are specifically formulated to act as barriers against contamination, chemicals, moisture, and handling damage. These materials dispense easily, cure quickly, and provide a protective surface that is dry and tack-free. 

LED curable adhesives are included in Panacol-USA’s product selection for electronic component potting and encapsulating. These adhesives fully cure in fractions of a second under low intensity UV or Visible light. They are ideal for use with LED light curing equipment.

Panacol-USA’s broad selection of potting materials bond to a variety of substrates including ABS, nylon, polycarbonate, and plated metals. Light curable materials are available with a secondary thermal cure catalyst in the event that shadowed areas exist in the potting field. Typical thermal curing schedules are identified on individual product technical data sheets.

Processing time for shallow potting of electronic and electrical components can be significantly reduced by incorporating light curable potting materials from Panacol-USA. These electronic component potting materials are formulated to protect components and connectors from thermal shock, vibration, moisture, and other environmental elements.

Electronic components of a sensor are shielded from damage with a black potting compound

UV curing equipment:

UV system solutions with Panacol uv curable adhesives and innovative curing systems from Honle

Adhesives of the Vitralit® line are light curable potting materials. They are single component and solvent-free, and are easily dispensed from automated valve dispensing systems. A wide range of viscosities are available to meet component configuration and processing challenges. When cured, these materials exhibit dry, tack-free surfaces that resist contamination from airborne particulates and handling.

Structalit® adhesives  are  solvent  free  single  or  two-component  adhesives.  They  are  mostly based  on  epoxy  resin  and  can  be cured  at room  temperature  or  by  exposure  of  heat. For heat-sensitive components low temperature curing adhesives are available.
View the potting products listed below for a possible candidate for your application. Please contact Panacol-USA to confirm your product selection and to secure additional application assistance, including samples and process recommendations.

New from Panacol are single component epoxy adhesives that cure at low temperatures, (60oC).  Structalit® 5511, 5521, and 5531 adhesives were specifically formulated for microelectronics applications and adhere very well to low surface energy substrates.  These products are ideally suited for potting temperature sensitive components.  Find them in our table below and click on their Technical Data Sheets for more detailed information. 

 

Potting materials: Viscosity [mPas] Base Curing* Properties
Vitralit® 1600 LV 3,000-5,000 epoxy UV
secondary heat cure
Very high Tg
low water absorption
low ion content
very high chemical resistance
Vitralit® 1650 6,000-9,000 epoxy UV Electronic grade
low ion content
suitable for chip protection
Vitralit® 1657 5,000-15,000 epoxy UV Low ion content
excellent chemical resistance
low water absorption
suitable for covering open bonded chips
Vitralit® 1671 9,000-14,000 epoxy UV
secondary heat cure
Stable frame compound
high ion purity
electronic grade adhesive
high temperature conductivity
low water absorption
Vitralit® 1680 5,000-8,000 epoxy UV Very high resistance to heat and humidity
electronic grade adhesive
low ion content
suitable for chip protection
Vitralit® UD 5180 4,000-6,000 epoxy UV
secondary heat cure
Perfect solution for bonding flexible circuit paths
resistant to reflow processes
grey color
Structalit® 5894 45,000-55,000 epoxy thermal Black color
excellent flow properties
filling material for frame and fill applications on PCBs,
very high resistance to heat and chemicals
Vitralit® 90020
Vitralit® 90046
Vitralit® 90075
Vitralit® 90086
Structalit® 5511 800-1,200 epoxy thermal at 60°C Non-conductive
Outstanding adhesion to high performance
plastics (LCP, PBT)
High purity
Electronic grade standard
Structalit® 5521 1,000-1,600 epoxy thermal at 60°C Non-conductive
Outstanding adhesion to high performance
plastics (LCP, PBT)
High purity
Electronic grade standard
Flexible
Structalit® 5531 5,000-10,000 epoxy thermal at 60°C Non-conductive
Outstanding adhesion to high performance plastics (LCP, PBT)
High purity
Electronic grade standard
Good mechanical stability
Good chemical resistance

*UV = 320 - 390 nm          VIS = 405 nm

To download the technical datasheets (TDS) please click on the adhesive name.