Electronic Component Potting

Electronic components inherently require protection from moisture and mechanical damage. For this reason, they are typically sealed with materials offering protective properties. These processes take place prior to next level of PCB assembly. Components such as capacitors, switches, and relays are typically designed with shallow cavities for containment, so that low viscosity potting materials may be dispensed quickly during automated production.

Panacol-USA offers single component, light curable potting materials of the Vitralit^® brand, or thermally curing potting compounds of the Structalit^® line. Both adhesive brands are specifically formulated to act as barriers against contamination, chemicals, moisture, and handling damage. These materials dispense easily, cure quickly, and provide a protective surface that is dry and tack-free. 

LED curable adhesives are included in Panacol-USA’s product selection for electronic component potting and encapsulating. These adhesives fully cure in fractions of a second under low intensity UV or Visible light. They are ideal for use with LED light curing equipment.

Panacol-USA’s broad selection of potting materials bond to a variety of substrates including ABS, nylon, polycarbonate, and plated metals. Light curable materials are available with a secondary thermal cure catalyst in the event that shadowed areas exist in the potting field. Typical thermal curing schedules are identified on individual product technical data sheets.

Processing time for shallow potting of electronic and electrical components can be significantly reduced by incorporating light curable potting materials from Panacol-USA. These electronic component potting materials are formulated to protect components and connectors from thermal shock, vibration, moisture, and other environmental elements.

Electronic components of a sensor are shielded from damage with a black potting compound