Electronic Component Potting

Electronic components inherently require protection from moisture and mechanical damage. For this reason, they are typically sealed with materials offering protective properties. These processes take place prior to next level of PCB assembly. Components such as capacitors, switches, and relays are typically designed with shallow cavities for containment, so that low viscosity potting materials may be dispensed quickly during automated production.

Panacol-USA offers single component, light curable potting materials of the Vitralit® brand, or thermally curing potting compounds of the Structalit® line. Both adhesive brands are specifically formulated to act as barriers against contamination, chemicals, moisture, and handling damage. These materials dispense easily, cure quickly, and provide a protective surface that is dry and tack-free. 

Electronic components of a sensor are shielded from damage with a black potting compound

LED curable adhesives are included in Panacol-USA’s product selection for electronic component potting and encapsulating. These adhesives fully cure in fractions of a second under low intensity UV or Visible light. They are ideal for use with LED light curing equipment.

Panacol-USA’s broad selection of potting materials bond to a variety of substrates including ABS, nylon, polycarbonate, and plated metals. Light curable materials are available with a secondary thermal cure catalyst in the event that shadowed areas exist in the potting field. Typical thermal curing schedules are identified on individual product technical data sheets.
Processing time for shallow potting of electronic and electrical components can be significantly reduced by incorporating light curable potting materials from Panacol-USA. These electronic component potting materials are formulated to protect components and connectors from thermal shock, vibration, moisture, and other environmental elements.

Adhesives of the Vitralit® line are light curable potting materials. They are single component and solvent-free, and are easily dispensed from automated valve dispensing systems. A wide range of viscosities are available to meet component configuration and processing challenges. When cured, these materials exhibit dry, tack-free surfaces that resist contamination from airborne particulates and handling.

Structalit® adhesives  are  solvent  free  single  or  two-component  adhesives.  They  are  mostly based  on  epoxy  resin  and  can  be cured  at room  temperature  or  by  exposure  of  heat. For heat-sensitive components low temperature curing adhesives are available.
View the potting products listed below for a possible candidate for your application. Please contact Panacol-USA to confirm your product selection and to secure additional application assistance, including samples and process recommendations.

Potting materials: Viscosity [mPas] Base Curing*
Vitralit® 1600 LV 5,000-6,000 epoxy UV
secondary heat cure
Vitralit® 1650 6,000-9,000 epoxy UV
Vitralit® 1657 120,000-130,000 epoxy UV
Vitralit® 1671 250,000-300,000 epoxy UV
secondary heat cure
Vitralit® 1680 6,000-9,000 epoxy UV
Vitralit® UD 5180 18,000-25,000 epoxy UV
secondary heat cure
Structalit® 5894 45,000-55,000 epoxy thermal
Structalit® 5720 10,000-15,000 epoxy thermal
Vitralit® 90020
Vitralit® 90046
Vitralit® 90075
Vitralit® 90086

*UV = 320 - 390 nm          VIS = 405 nm

To download the technical datasheets (TDS) please click on the adhesive name.