Encapsulation of Electronic Components
Glob Top and Dam & Fill encapsulation provides protection for individual electronic components attached to PCB’s and FPC’s. Encapsulated components, like flip-chips, semiconductor die chips, delicate lead wires, etc., are shielded from environmental stresses, contamination, and mechanical vibration. Encapsulating materials serve to neutralize dissimilar Coefficient of Thermal Expansion (CTE) values between the component and board. In addition, these materials improve individual component insulation, minimizing current loss.
Glob Top and Dam & Fill (or Frame & Fill) processes are integrated into automated assembly lines using programmable, robotic dispensing equipment. The encapsulating materials are deposited directly on the components and boards in precise, repeatable patterns.
Panacol-USA produces single component, light curable encapsulants with performance properties that are ideal for high volume production lines. These encapsulation materials are highly resistant to contaminants, cure with minimal shrinkage, and remain extremely flexible to minimize risk of damage to fine wire leads and connections.
Black glob top adhesives are applied on smart card chips to protect the chips from damage
Similar to sealants and coatings, encapsulants provide environmental protection for individual electronic components such as diodes, capacitors, and integrated circuits (IC), as well as wire leads and other fragile connectors. The encapsulant’s composition must reflect high ionic purity, and preferred cured properties include moisture resistance, invulnerability to thermocycling, low shrink, and flexibility from a low modulus value. Low shrink and flexibility are significant as the encapsulant also functions as a strain relief for fine wire leads. Lower stress minimizes the risk of wire breakage.
Encapsulants offered by Panacol-USA have been formulated with all these desirable properties in mind. Panacol-USA’s line of encapsulants feature excellent adhesion to substrates associated with PCB and FPC assembly, including polyimide, metals, FR-4 (glass-epoxy), PET, polycarbonate, ceramic, and glass. They are offered in a range of viscosities to better support numerous component geometries. For example, in order for the encapsulant to create a uniform coating (shell) on sharp-edged components, it should generally be higher in viscosity and thixotropic.
View the Encapsulant products listed below for a possible candidate for your application. Please contact Panacol-USA to confirm your product selection and to secure additional application assistance, including samples and process recommendations. In the event that these standard products do not satisfactorily address your performance requirements, Panacol-USA will investigate other solutions that include development of adhesive specifically tailored to the complexity of your application.
| Encapsulant | Application | Viscosity [mPas] | Base | Curing* | Properties |
|---|---|---|---|---|---|
| Structalit® 5800 |
encapsulation of electronic components potting material encapsulation of plastic parts plastic bonding automotive, aerospace |
7,000-15,000 | 2-part epoxy | thermal, room temperature |
High temperature resistance short pot life fast application |
| Structalit® 5810 |
encapsulation of electronic components potting material encapsulation of plastic parts plastic bonding automotive, aerospace glass bonding |
2,000-3,000 | 2-part epoxy |
thermal room temperature |
Very high adhesion to PC resistant to moisture and chemicals |
| Structalit® 5891 |
glob top encapsulation plastic bonding SMD assembly |
300,000-400,000 | epoxy | thermal |
Black color fast curing at low temperatures impact resistant |
| Structalit® 5891 T |
glob top encapsulation SMD assembly attaching components on PCBs |
80,000-150,000 | epoxy | thermal |
Black color stable frame mat. can be applied wet-in-wet with filling material (e.g. Structalit® 5893) stable edges resistant to shocks |
| Structalit® 5892 |
glob top encapsulation SMD assembly |
200,000-300,000 | epoxy | thermal | black |
| Structalit® 5893 |
glob top encapsulation SMD assembly medical technology needle bonding |
6,000-10,000 | epoxy | thermal |
Black color excellent flow properties filling material high resistance to heat and chemicals certified to ISO 10993-5 standards |
| Structalit® 5894 |
glob top encapsulation encapsulation of electronic components SMD assembly automotive, aerospace potting material |
45,000-55,000 | epoxy | thermal |
Black color excellent flow properties filling material very high resistance to heat and chemicals |
| Structalit® 8801 |
attaching components on PCBs encapsulation of electronic components SMD assembly encapsulation of plastic parts potting material automotive, aerospace |
30,000-45,000 | epoxy | thermal |
Resistant to oils grease and fuels excellent flow properties beige color certified to ISO 10993-5 standards |
| Structalit® 8805 |
attaching components on PCBs encapsulation of electronic components SMD assembly encapsulation of plastic parts potting material automotive, aerospace |
30,000-45,000 | epoxy | thermal |
Resistant to oils grease and fuels excellent flow properties beige color |
| Structalit® 8838 |
attaching components on PCBs encapsulation of electronic components SMD assembly |
6,500-7,500 | epoxy | thermal |
Black color flexible potting compound excellent flow properties |
| Structalit® 8926 |
attaching components on PCBs encapsulation of electronic components SMD assembly encapsulation of plastic parts potting material automotive, aerospace |
30,000-45,000 | epoxy | thermal |
Resistant to oils grease and fuels excellent flow properties beige color |
| Vitralit® 1600 LV |
attaching components on PCBs conformal coating encapsulation of electronic components chip encapsulation potting material automotive, aerospace smart card |
5,000-6,000 | epoxy |
UV secondary heat cure |
Very high Tg low water absorption low ion content very high chemical resistance |
| Vitralit® 1605 |
encapsulation of electronic components optical cement lens bonding cement glass bonding potting material |
200-400 | epoxy |
UV secondary heat cure |
low shrinkage low heat expansion very high tg excellent chemical resistance certified to ISO 10993-5 standards |
| Vitralit® 1655 |
conformal coating encapsulation of electronic components glass bonding potting material medical technology |
150-300 | epoxy |
UV secondary heat cure |
flexible certified to USP Class VI and ISO 10993-5 standards resistant to all common sterilization methods |
| Vitralit® 1657 |
glob top encapsulation conformal coating encapsulation of electronic components chip encapsulation potting material attaching components on PCBs SMD assembly display sealing |
120,000-130,000 | epoxy | UV |
Low ion content excellent chemical resistance low water absorption suitable for covering open bonded chips |
| Vitralit® 1671 |
glob top encapsulation conformal coating encapsulation of electronic components chip encapsulation potting material attaching components on PCBs SMD assembly display sealing smart card |
250,000-300,000 | epoxy |
UV secondary heat cure |
Stable dam compound high ion purity electronic grade adhesive high temperature conductivity low water absorption |
| Vitralit® 1680 |
glob top encapsulation conformal coating encapsulation of electronic components chip encapsulation potting material smart card |
6,000-9,000 | epoxy | UV |
Very high resistance to heat and humidity electronic grade adhesive low ion content suitable for chip protection |
| Vitralit® 1688 |
glob top encapsulation conformal coating encapsulation of electronic components chip encapsulation potting material smart card |
3,000-4,000 | epoxy | UV |
Excellent flow properties and leveling electronic grade adhesive low ion content suitable for chip protection excellent resistance to heat and humidity |
| Vitralit® 1691 | glob top encapsulation | 280,000-310,000 | epoxy |
UV secondary heat cure |
black color high ion purity electronic grade adhesive high temperature resistance fast surface curing with UV light |
| Vitralit® 1720 |
attaching components on PCBs encapsulation of electronic components SMD assembly lens bonding cement glass bonding encapsulation of plastic parts plastic bonding potting material automotive, aerospace |
2,700-3,700 | epoxy | UV |
Low shrinkage high temperature resistance |
| Vitralit® 1722 |
attaching components on PCBs encapsulation of electronic components SMD assembly lens bonding cement glass bonding encapsulation of plastic parts plastic bonding potting material automotive, aerospace |
5,000-8,000 | epoxy | UV |
Very high adhesion to most thermoplastics low shrinkage high temperature resistance |
| Vitralit® 5140 |
encapsulation of electronic components encapsulation of plastic parts plastic bonding plastic film lamination medical technology potting material |
250-500 | acrylate |
UV VIS |
Flexible well suited for bonding plastics with low UV translucence and permeable to visible light certified to USP Class VI standards |
| Vitralit® 6103 |
encapsulation of electronic components SMD assembly potting material automotive, aerospace |
3,500-5,000 | acrylate |
UV secondary heat cure |
Very high adhesion to metals and sintered materials transparent |
| Vitralit® 6104 |
encapsulation of electronic components SMD assembly automotive, aerospace |
3,500-6,000 | acrylate |
UV secondary heat cure |
Very high adhesion to metals and sintered materials |
| Vitralit® 6104 VT |
encapsulation of electronic components SMD assembly attaching components on PCBs automotive, aerospace |
80,000-90,000 | acrylate |
UV secondary heat cure |
Very high adhesion to metals and sintered materials ideal for bonding large components on circuit boards (corner bonding) |
| Vitralit® 6105 |
encapsulation of electronic components SMD assembly automotive, aerospace |
3,500-6,000 | acrylate |
UV secondary heat cure |
very high adhesion to metals and sintered materials |
| Vitralit® 6125 |
attaching components on PCBs potting material encapsulation of electronic components SMD assembly lens bonding cement glass bonding automotive, aerospace |
4,000-6,000 | acrylate |
UV secondary heat cure |
contains chemical activator excellent adhesion to stone, glass, metals and thermoplastics high temperature resistance medium viscosity |
| Vitralit® 6128 |
attaching components on PCBs encapsulation of electronic components SMD assembly lens bonding cement glass bonding potting material |
800-1,200 | acrylate |
UV secondary heat cure |
contains chemical activator very high adhesion to stone glass metals and thermoplastics high temperature resistance |
| Vitralit® 6128 VT |
attaching components on PCBs encapsulation of electronic components SMD assembly lens bonding cement glass bonding potting material |
18,000-30,000 | acrylate |
UV secondary heat cure |
contains chemical activator high temperature resistance high viscosity excellent adhesion to stone glass metals and thermoplastics |
| Vitralit® 9180 |
encapsulation of electronic components encapsulation of plastic parts potting material SMD assembly |
700-1,200 | acrylate | UV |
Dry surface fast curing of thick layers yellow color |
| Vitralit® 9181 |
encapsulation of electronic components encapsulation of plastic parts potting material SMD assembly |
4,000-7,000 | acrylate | UV |
Yellow color dry surface fast curing of thick layers |
| Structalit® 5704 |
encapsulant glob top dam and fill |
300,000-500,000 | epoxy | thermal |
high stability high glass transition temperature no bleeding very low ion content |
| Structalit® 5720 |
encapsulant electronic component potting dam and fill |
10,000-15,000 | epoxy | thermal |
very good flowability high glass transition temperature no bleeding very low ion content |
| Structalit® 8801 T |
attaching components on PCBs encapsulation of electronic components SMD assembly encapsulation of plastic parts potting material automotive, aerospace |
thixotropic | epoxy | thermal |
Resistant to oils grease and fuels stable |
| Vitralit® UD 5180 |
glob top encapsulation attaching components on PCBs conformal coating encapsulation of electronic components SMD assembly plastic bonding potting material automotive, aerospace |
18,000-25,000 | epoxy |
UV secondary heat cure |
Perfect solution for bonding flexible circuit paths resistant to reflow processes grey color |
| Vitralit® VBB 1 |
encapsulation of electronic components glass bonding display encapsulation plastic film lamination plastic bonding potting material |
1,000-1,500 | acrylate |
UV VIS |
Elastic high peel strength optically clear very flexible suitable for potting |
| Vitralit® 2004 F |
conformal coating encapsulation of electronic components potting material automotive, aerospace |
60-100 | epoxy |
UV secondary heat cure |
fluorescing flexible autoclavable dry surface after curing low ion content sprayable |
| Vitralit® 2007 F |
conformal coating encapsulation of electronic components potting material automotive, aerospace |
200-500 | epoxy |
UV secondary heat cure |
fluorescing flexible autoclavable excellent chemical resistance low ion content |
| Vitralit® 2009 F |
conformal coating encapsulation of electronic components potting material automotive, aerospace |
100-200 | epoxy |
UV secondary heat cure |
fluorescing flexible autoclavable high chemical resistance low ion content |
| Vitralit® 2028 |
conformal coating encapsulation of electronic components potting material glass bonding automotive, aerospace |
160-300 | epoxy |
UV secondary heat cure |
Dry surface after UV-curing autoclavable excellent chemical resistance scratch resistant coating |
| Vitralit® 4451 |
conformal coating plastic bonding plastic film lamination dome coating |
500-800 | acrylate | UV |
Low shrinkage soft and elastic dry surface after curing protective coating |
| Vitralit® 9179 |
encapsulation of electronic components encapsulation of plastic parts potting material SMD assembly |
200-400 | acrylate | UV |
Fast curing very well suited for automated production lines yellow color dry surface |
| Vitralit® 90008 | Encapsulant | ||||
| Vitralit® 90013 | Encapsulant | ||||
| Vitralit® 90015 | Encapsulant | ||||
| Vitralit® 90086 | Encapsulant | ||||
| Vitralit® 90830 | Encapsulant |
*UV = 320 - 390 nm VIS = 405 nm
To download the technical datasheets (TDS) please click on the adhesive name.