Encapsulation of Electronic Components

Glob Top and Dam & Fill encapsulation provides protection for individual electronic components attached to PCB’s and FPC’s. Encapsulated components, like flip-chips, semiconductor die chips, delicate lead wires, etc., are shielded from environmental stresses, contamination, and mechanical vibration. Encapsulating materials serve to neutralize dissimilar Coefficient of Thermal Expansion (CTE) values between the component and board. In addition, these materials improve individual component insulation, minimizing current loss.

Glob Top and Dam & Fill (or Frame & Fill) processes are integrated into automated assembly lines using programmable, robotic dispensing equipment. The encapsulating materials are deposited directly on the components and boards in precise, repeatable patterns.

Panacol-USA produces single component, light curable encapsulants with performance properties that are ideal for high volume production lines. These encapsulation materials are highly resistant to contaminants, cure with minimal shrinkage, and remain extremely flexible to minimize risk of damage to fine wire leads and connections.

Black glob top adhesives are applied on smart card chips to protect the chips from damage

Similar to sealants and coatings, encapsulants provide environmental protection for individual electronic components such as diodes, capacitors, and integrated circuits (IC), as well as wire leads and other fragile connectors. The encapsulant’s composition must reflect high ionic purity, and preferred cured properties include moisture resistance, invulnerability to thermocycling, low shrink, and flexibility from a low modulus value. Low shrink and flexibility are significant as the encapsulant also functions as a strain relief for fine wire leads. Lower stress minimizes the risk of wire breakage.

Encapsulants offered by Panacol-USA have been formulated with all these desirable properties in mind. Panacol-USA’s line of encapsulants feature excellent adhesion to substrates associated with PCB and FPC assembly, including polyimide, metals, FR-4 (glass-epoxy), PET, polycarbonate, ceramic, and glass. They are offered in a range of viscosities to better support numerous component geometries. For example, in order for the encapsulant to create a uniform coating (shell) on sharp-edged components, it should generally be higher in viscosity and thixotropic.

View the Encapsulant products listed below for a possible candidate for your application. Please contact Panacol-USA to confirm your product selection and to secure additional application assistance, including samples and process recommendations. In the event that these standard products do not satisfactorily address your performance requirements, Panacol-USA will investigate other solutions that include development of adhesive specifically tailored to the complexity of your application.
 

Encapsulant Application Viscosity [mPas] Base Curing* Properties
Structalit® 5800 encapsulation of electronic components
potting material
encapsulation of plastic parts
plastic bonding
automotive, aerospace
7,000-15,000 2-part epoxy thermal, room temperature High temperature resistance
short pot life
fast application
Structalit® 5810 encapsulation of electronic components
potting material
encapsulation of plastic parts
plastic bonding
automotive, aerospace
glass bonding
2,000-3,000 2-part epoxy thermal
room temperature
Very high adhesion to PC
resistant to moisture and chemicals
Structalit® 5891 glob top encapsulation
plastic bonding
SMD assembly
300,000-400,000 epoxy thermal Black color
fast curing at low temperatures
impact resistant
Structalit® 5891 T glob top encapsulation
SMD assembly
attaching components on PCBs
80,000-150,000 epoxy thermal Black color
stable frame mat.
can be applied wet-in-wet with filling material (e.g. Structalit® 5893)
stable edges
resistant to shocks
Structalit® 5892 glob top encapsulation
SMD assembly
200,000-300,000 epoxy thermal black
Structalit® 5893 glob top encapsulation
SMD assembly
medical technology
needle bonding
6,000-10,000 epoxy thermal Black color
excellent flow properties
filling material
high resistance to heat and chemicals
certified to ISO 10993-5 standards
Structalit® 5894 glob top encapsulation
encapsulation of electronic components
SMD assembly
automotive, aerospace
potting material
45,000-55,000 epoxy thermal Black color
excellent flow properties
filling material
very high resistance to heat and chemicals
Structalit® 8801 attaching components on PCBs
encapsulation of electronic components
SMD assembly
encapsulation of plastic parts
potting material
automotive, aerospace
30,000-45,000 epoxy thermal Resistant to oils
grease and fuels
excellent flow properties
beige color
certified to ISO 10993-5 standards
Structalit® 8805 attaching components on PCBs
encapsulation of electronic components
SMD assembly
encapsulation of plastic parts
potting material
automotive, aerospace
30,000-45,000 epoxy thermal Resistant to oils
grease and fuels
excellent flow properties
beige color
Structalit® 8838 attaching components on PCBs
encapsulation of electronic components
SMD assembly
6,500-7,500 epoxy thermal Black color
flexible potting compound
excellent flow properties
Structalit® 8926 attaching components on PCBs
encapsulation of electronic components
SMD assembly
encapsulation of plastic parts
potting material
automotive, aerospace
30,000-45,000 epoxy thermal Resistant to oils
grease and fuels
excellent flow properties
beige color
Vitralit® 1600 LV attaching components on PCBs
conformal coating
encapsulation of electronic components
chip encapsulation
potting material
automotive, aerospace
smart card
5,000-6,000 epoxy UV
secondary heat cure
very high Tg
low water absorption
low ion content
very high chemical resistance
Vitralit® 1605 encapsulation of electronic components
optical cement
lens bonding cement
glass bonding
potting material
200-400 epoxy UV
secondary heat cure
low shrinkage
low heat expansion
very high tg
excellent chemical resistance
certified to ISO 10993-5 standards
Vitralit® 1655 conformal coating
encapsulation of electronic components
glass bonding
potting material
medical technology
150-300 epoxy UV
secondary heat cure
flexible
certified to USP Class VI and ISO 10993-5 standards
resistant to all common sterilization methods
Vitralit® 1657 glob top encapsulation
conformal coating
encapsulation of electronic components
chip encapsulation
potting material
attaching components on PCBs
SMD assembly
display sealing
120,000-130,000 epoxy UV Low ion content
excellent chemical resistance
low water absorption
suitable for covering open bonded chips
Vitralit® 1671 glob top encapsulation
conformal coating
encapsulation of electronic components
chip encapsulation
potting material
attaching components on PCBs
SMD assembly
display sealing
smart card
250,000-300,000 epoxy UV
secondary heat cure
stable dam compound
high ion purity
electronic grade adhesive
high temperature conductivity
low water absorption
Vitralit® 1680 glob top encapsulation
conformal coating
encapsulation of electronic components
chip encapsulation
potting material
smart card
6,000-9,000 epoxy UV Very high resistance to heat and humidity
electronic grade adhesive
low ion content
suitable for chip protection
Vitralit® 1688 glob top encapsulation
conformal coating
encapsulation of electronic components
chip encapsulation
potting material
smart card
3,000-4,000 epoxy UV Excellent flow properties and leveling
electronic grade adhesive
low ion content
suitable for chip protection
excellent resistance to heat and humidity
Vitralit® 1691 glob top encapsulation 280,000-310,000 epoxy UV
secondary heat cure
black color
high ion purity
electronic grade adhesive
high temperature resistance
fast surface curing with UV light
Vitralit® 1720 attaching components on PCBs
encapsulation of electronic components
SMD assembly
lens bonding cement
glass bonding
encapsulation of plastic parts
plastic bonding
potting material
automotive, aerospace
2,700-3,700 epoxy UV Low shrinkage
high temperature resistance
Vitralit® 1722 attaching components on PCBs
encapsulation of electronic components
SMD assembly
lens bonding cement
glass bonding
encapsulation of plastic parts
plastic bonding
potting material
automotive, aerospace
5,000-8,000 epoxy UV Very high adhesion to most thermoplastics
low shrinkage
high temperature resistance
Vitralit® 5140 encapsulation of electronic components
encapsulation of plastic parts
plastic bonding
plastic film lamination
medical technology
potting material
250-500 acrylate UV
VIS
Flexible
well suited for bonding plastics with low UV translucence and permeable to visible light
certified to USP Class VI standards
Vitralit® 6103 encapsulation of electronic components
SMD assembly
potting material
automotive, aerospace
3,500-5,000 acrylate UV
secondary heat cure
Very high adhesion to metals and sintered materials
transparent
Vitralit® 6104 encapsulation of electronic components
SMD assembly
automotive, aerospace
3,500-6,000 acrylate UV
secondary heat cure
very high adhesion to metals and sintered materials
Vitralit® 6104 VT encapsulation of electronic components
SMD assembly
attaching components on PCBs
automotive, aerospace
80,000-90,000 acrylate UV
secondary heat cure
very high adhesion to metals and sintered materials
ideal for bonding large components on circuit boards (corner bonding)
Vitralit® 6105 encapsulation of electronic components
SMD assembly
automotive, aerospace
3,500-6,000 acrylate UV
secondary heat cure
very high adhesion to metals and sintered materials
Vitralit® 6125 attaching components on PCBs
potting material
encapsulation of electronic components
SMD assembly
lens bonding cement
glass bonding
automotive, aerospace
4,000-6,000 acrylate UV
secondary heat cure
contains chemical activator
excellent adhesion to stone, glass, metals and thermoplastics
high temperature resistance
medium viscosity
Vitralit® 6128 attaching components on PCBs
encapsulation of electronic components
SMD assembly
lens bonding cement
glass bonding
potting material
800-1,200 acrylate UV
secondary heat cure
contains chemical activator
very high adhesion to stone
glass
metals and thermoplastics
high temperature resistance
Vitralit® 6128 VT attaching components on PCBs
encapsulation of electronic components
SMD assembly
lens bonding cement
glass bonding
potting material
18,000-30,000 acrylate UV
secondary heat cure
contains chemical activator
high temperature resistance
high viscosity
excellent adhesion to stone
glass
metals and thermoplastics
Vitralit® 9180 encapsulation of electronic components
encapsulation of plastic parts
potting material
SMD assembly
700-1,200 acrylate UV Dry surface
fast curing of thick layers
yellow color
Vitralit® 9181 encapsulation of electronic components
encapsulation of plastic parts
potting material
SMD assembly
4,000-7,000 acrylate UV Yellow color
dry surface
fast curing of thick layers
Structalit® 5704 encapsulant
glob top
dam and fill
300,000-500,000 epoxy thermal high stability
high glass transition temperature
no bleeding
very low ion content
Structalit® 5720 encapsulant
electronic component potting
dam and fill
10,000-15,000 epoxy thermal very good flowability
high glass transition temperature
no bleeding
very low ion content
Structalit® 8801 T attaching components on PCBs
encapsulation of electronic components
SMD assembly
encapsulation of plastic parts
potting material
automotive, aerospace
thixotropic epoxy thermal Resistant to oils
grease and fuels
stable
Vitralit® UD 5180 glob top encapsulation
attaching components on PCBs
conformal coating
encapsulation of electronic components
SMD assembly
plastic bonding
potting material
automotive, aerospace
18,000-25,000 epoxy UV
secondary heat cure
perfect solution for bonding flexible circuit paths
resistant to reflow processes
grey color
Vitralit® UD 8559 LV encapsulation of electronic components
potting material
automotive, aerospace
700-1,000 acrylate UV
VIS
moisture
Tackfree surface
liquid
suitable for pin sealing
Vitralit® VBB 1 encapsulation of electronic components
glass bonding
display encapsulation
plastic film lamination
plastic bonding
potting material
1,000-1,500 acrylate UV
VIS
Elastic
high peel strength
optically clear
very flexible
suitable for potting
Vitralit® 2004 F conformal coating
encapsulation of electronic components
potting material
automotive, aerospace
60-100 epoxy UV
secondary heat cure
fluorescing
flexible
autoclavable
dry surface after curing
low ion content
sprayable
Vitralit® 2007 F conformal coating
encapsulation of electronic components
potting material
automotive, aerospace
200-500 epoxy UV
secondary heat cure
fluorescing
flexible
autoclavable
excellent chemical resistance
low ion content
Vitralit® 2009 F conformal coating
encapsulation of electronic components
potting material
automotive, aerospace
100-200 epoxy UV
secondary heat cure
fluorescing
flexible
autoclavable
high chemical resistance
low ion content
Vitralit® 2028 conformal coating
encapsulation of electronic components
potting material
glass bonding
automotive, aerospace
160-300 epoxy UV
secondary heat cure
dry surface after UV-curing
autoclavable
excellent chemical resistance
scratch resistant coating
Vitralit® 4451 conformal coating
plastic bonding
plastic film lamination
dome coating
500-800 acrylate UV Low shrinkage
soft and elastic
dry surface after curing
protective coating
Vitralit® 9179 encapsulation of electronic components
encapsulation of plastic parts
potting material
SMD assembly
200-400 acrylate UV Fast curing
very well suited for automated production lines
yellow color
dry surface
Vitralit® 90008 Encapsulant
Vitralit® 90013 Encapsulant
Vitralit® 90015 Encapsulant
Vitralit® 90086 Encapsulant
Vitralit® 90830 Encapsulant

*UV = 320 - 390 nm          VIS = 405 nm

To download the technical datasheets (TDS) please click on the adhesive name.