Encapsulation of Electronic Components

Glob Top and Dam & Fill encapsulation provides protection for individual electronic components attached to PCB’s and FPC’s. Encapsulated components, like flip-chips, semiconductor die chips, delicate lead wires, etc., are shielded from environmental stresses, contamination, and mechanical vibration. Encapsulating materials serve to neutralize dissimilar Coefficient of Thermal Expansion (CTE) values between the component and board. In addition, these materials improve individual component insulation, minimizing current loss.

Glob Top and Dam & Fill (or Frame & Fill) processes are integrated into automated assembly lines using programmable, robotic dispensing equipment. The encapsulating materials are deposited directly on the components and boards in precise, repeatable patterns.

Panacol-USA produces single component, light curable encapsulants with performance properties that are ideal for high volume production lines. These encapsulation materials are highly resistant to contaminants, cure with minimal shrinkage, and remain extremely flexible to minimize risk of damage to fine wire leads and connections.

Similar to sealants and coatings, encapsulants provide environmental protection for individual electronic components such as diodes, capacitors, and integrated circuits (IC), as well as wire leads and other fragile connectors. The encapsulant’s composition must reflect high ionic purity, and preferred cured properties include moisture resistance, invulnerability to thermocycling, low shrink, and flexibility from a low modulus value. Low shrink and flexibility are significant as the encapsulant also functions as a strain relief for fine wire leads. Lower stress minimizes the risk of wire breakage.

Black glob top adhesives are applied on smart card chips to protect the chips from damage