As their exclusive distributor for the Americas, Panacol-USA provides Elecolit® brand epoxies from Panacol-Elosol. Panacol-Elosol GmbH is a member of the Honle Group headquartered in Germany, and has been formulating and manufacturing adhesives for over 30 years.
In select applications, Elecolit® electrically conductive adhesives from Panacol-USA can have significant advantages over traditional soldering methods. Some of their benefits include:
- Connecting thermally sensitive components – curing occurs at low temperatures (<200°C)
- Strain relief for electrical connections that experience significant stress during operation
- Attaching components where connections are not accessible for soldering
- Electrically conductive adhesives are solvent and lead-free
- No cleaning or flux is required
- Easily incorporated into existing assembly processes
Elecolit® electrically conductive adhesives include thermally curable one and two-component products as well as a UV light curable, anisotropic adhesive series. While single component adhesives simplify dispensing and processing, two-component adhesives provide longer shelf life and can be cured at room temperature. The range of adhesive compositions includes epoxies, acrylates, and polyamides. To facilitate practical conductivity, fillers such as palladium, gold, silver, copper, nickel, and graphite are used.
View the electrically conductive adhesive products listed below for a possible candidate for your application. Please contact Panacol-USA to confirm your product selection and to secure additional application assistance, including samples and process recommendations. In the event that these standard products do not satisfactorily address your performance requirements, Panacol-USA will investigate other solutions that include development of adhesive specifically tailored to the complexity of your application.
|Product Number||Suitable Applications||Viscosity cP mPa||Shore Durometer||24 Hour Water Absorbtion||LEDcure||Bondable Substrates||Comments/Features||Request|
|electrical conductivity/die attach/flip-chip bonding/antenna connection||paste||D82||n/a||n/a||FR4 epoxy board, glass, metal, ceramic, plastics||one component epoxy, 10 minute thermal cure, silver filled, excellent gap filling properties, dispenses well by valve or screen printing|
|electrical conductivity/die attach/flip-chip bonding/antenna connection||2800||D82||n/a||n/a||FR4 epoxy board, glass, metal, ceramic, plastics||two component epoxy, quick low-temp or rapid high-temp snap cure, excellent for bonding heat sensitive components|
|electrical conductivity/die attach/flip-chip bonding/antenna connection||paste (80,000-90,000)||D70-80||< 0.5%||n/a||FR4 epoxy board, glass, metal, ceramic, plastics||2 part epoxy, short curing time at high temperatrue, curing at room temperature possible, suitable for heat sensitive substrates,good electrical conductivity, proven in automotive applications|
|electrical conductivity/die attach/flip-chip bonding/antenna connection||paste (80,000-90,000)||D70-80||< 0.5%||n/a||FR4 epoxy board, glass, metal, ceramic, plastics||2 part epoxy, short curing time at high temperatrue, curing at room temperature possible, suitable for heat sensitive substrates, medium level electrical conductivity|
|electrical conductivity/die attach/flip-chip bonding/antenna connection||4000-5000||D75-85||< 0.2%||n/a||FR4 epoxy board, glass, metal, ceramic, plastics||one component epoxy, refrigerated storage, thermal cure, high purity and low ionic content, fine grade filler for easy dispensing and precise placement, excellent material for antenna printing|
|electrical conductivity/die attach/flip-chip bonding/antenna connection||8000-10,000||D60-75||< 0.3%||n/a||FR4 epoxy board, glass, metal, ceramic, plastics||one component epoxy, refrigerated storage, fast thermal cure, flexible, vibration and impact resistant, easily dispensed|
|electrical conductivity/die attach/flip-chip bonding/antenna connection||150,000 - 450,000||D75-85||< 0.2%||n/a||FR4 epoxy board, glass, metal, ceramic, plastics, semi-conductor||highly filled material, excellent thermal conductivity, very good electrial conductivity, very small filler grain size, easy dispensable, high Tg and good resistnace after high curing temperature|
*Note: viscosity variations are typically available, or can be formulated, for all listed products. Please inquire with Panacol-USA Applications Engineering for viscosity ranges not shown in the table.
Contact Panacol-USA for more info.