Electrically Conductive Adhesives

Electrically conductive adhesives (Elecolit brand from Panacol-Elosol) for die bonding, underfilling, antennae printing, flip-chips, LCD, and flex circuit assembly. Elecolit electrically conductive adhesives include thermally curable one and two-component products and a UV light curable adhesive, anisotropic adhesive series.

Panacol-USA offers electrically conductive adhesives for applications involving die bonding, underfilling, antennae printing, flip-chips, LCD, and flex circuit assembly.
As their exclusive distributor for the Americas, Panacol-USA provides Elecolit® brand epoxies from Panacol-Elosol. Panacol-Elosol GmbH is a member of the Honle Group headquartered in Germany, and has been formulating and manufacturing adhesives for over 30 years.
In select applications, Elecolit® electrically conductive adhesives from Panacol-USA can have significant advantages over traditional soldering methods. Some of their benefits include:

  • Connecting thermally sensitive components – curing occurs at low temperatures (<200°C)
  • Strain relief for electrical connections that experience significant stress during operation
  • Attaching components where connections are not accessible for soldering
  • Electrically conductive adhesives are solvent and lead-free
  • No cleaning or flux is required
  • Easily incorporated into existing assembly processes

Elecolit® electrically conductive adhesives include thermally curable one and two-component products as well as a UV light curable, anisotropic adhesive series. While single component adhesives simplify dispensing and processing, two-component adhesives provide longer shelf life and can be cured at room temperature. The range of adhesive compositions includes epoxies, acrylates, and polyamides. To facilitate practical conductivity, fillers such as palladium, gold, silver, copper, nickel, and graphite are used.
View the electrically conductive adhesive products listed below for a possible candidate for your application. Please contact Panacol-USA to confirm your product selection and to secure additional application assistance, including samples and process recommendations. In the event that these standard products do not satisfactorily address your performance requirements, Panacol-USA will investigate other solutions that include development of adhesive specifically tailored to the complexity of your application.

Product NumberSuitable ApplicationsViscosity cP mPaShore Durometer24 Hour Water AbsorbtionLEDcureBondable SubstratesComments/FeaturesRequest
TDS button TDS
Sample button Sample
Elecolit 3012electrical conductivity/die attach/flip-chip bonding/antenna connectionpasteD82n/an/aFR4 epoxy board, glass, metal, ceramic, plasticsone component epoxy, 10 minute thermal cure, silver filled, excellent gap filling properties, dispenses well by valve or screen printingRequest sample button TDS button
Elecolit 3024electrical conductivity/die attach/flip-chip bonding/antenna connection2800D82n/an/aFR4 epoxy board, glass, metal, ceramic, plasticstwo component epoxy, quick low-temp or rapid high-temp snap cure, excellent for bonding heat sensitive componentsRequest sample button TDS button
Elecolit 3025electrical conductivity/die attach/flip-chip bonding/antenna connectionpaste (80,000-90,000)D70-80< 0.5%n/aFR4 epoxy board, glass, metal, ceramic, plastics2 part epoxy, short curing time at high temperatrue, curing at room temperature possible, suitable for heat sensitive substrates,good electrical conductivity, proven in automotive applications Request sample button TDS button
Elecolit 3036electrical conductivity/die attach/flip-chip bonding/antenna connectionpaste (80,000-90,000)D70-80< 0.5%n/aFR4 epoxy board, glass, metal, ceramic, plastics2 part epoxy, short curing time at high temperatrue, curing at room temperature possible, suitable for heat sensitive substrates, medium level electrical conductivityRequest sample button TDS button
Elecolit 3043electrical conductivity/die attach/flip-chip bonding/antenna connection4000-5000D75-85< 0.2%n/aFR4 epoxy board, glass, metal, ceramic, plasticsone component epoxy, refrigerated storage, thermal cure, high purity and low ionic content, fine grade filler for easy dispensing and precise placement, excellent material for antenna printingRequest sample button TDS button
Elecolit 3653electrical conductivity/die attach/flip-chip bonding/antenna connection8000-10,000D60-75< 0.3%n/aFR4 epoxy board, glass, metal, ceramic, plasticsone component epoxy, refrigerated storage, fast thermal cure, flexible, vibration and impact resistant, easily dispensedRequest sample button TDS button
Elecolit 3655electrical conductivity/die attach/flip-chip bonding/antenna connection150,000 - 450,000D75-85< 0.2%n/aFR4 epoxy board, glass, metal, ceramic, plastics, semi-conductorhighly filled material, excellent thermal conductivity, very good electrial conductivity, very small filler grain size, easy dispensable, high Tg and good resistnace after high curing temperatureRequest sample button TDS button

*Note: viscosity variations are typically available, or can be formulated, for all listed products. Please inquire with Panacol-USA Applications Engineering for viscosity ranges not shown in the table.
**Note: modifications can be made to most products in order to meet unique performance requirements. Adding fluorescing properties, color, and secondary curing mechanisms are typical examples of minor modifications. Please contact Panacol-USA Applications Engineering to discuss your specific requirements.

Contact Panacol-USA for more info.